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Test Item
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Test Standard
|
Description |
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ESD
|
HBM-Human Body Model |
JESD22-A114D
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Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) |
|
ANSI/ESD STM5.1
|
For Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) Component level |
| MM-Machine Model |
EIA/JESD-A115A
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Electrostatic Discharge (ESD)Sensitivity Testing Machine Model (MM) |
|
ESD STM5.2
|
For Electrostatic Discharge Sensitivity Testing Machine Model-Component Level |
|
Latch-Up
|
|
JESD78A
|
IC Latch-Up Test |
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Reliability
|
PCT-Pressure Cook Test |
JESD22-A102C
|
Accelerated Moisture Resistance-Unbiased Autoclave |
| TCT-Temperature Cycling Test |
JESD22-A104C
|
Check for mechanical integrity of the packaged device |
| TST-Thermal Shock Test |
JESD22-A106B
|
Check for die/package compatibility |
| SHT-Soldering Heat Test |
JESD22-B106C
|
Resistance to Soldering Temperature for Throught-Hole Mounted Devices |
| OLT-Operating Life Test |
JESD22-A108B
|
The OLT is a test performed to determine the reliability of devices under low temperature conditions over an extended period of time. |
| THB-Temperature & Humidity with Bias Test |
JESD22-A101B
|
Temperature & Humidity with Bias Test |
| HTGB-High Temperature Gate Bias Test |
JESD22-A108B
|
The test is used to verify die integrity at high voltage and temperature conditions. |
| HTRB-High Temperature Reverse Bias Test |
JESD22-A108B
|
The test is checked through stressing of the main blocking junction at an elevated temperature and voltage. |
| H3TRB-High 3 Temperature Reserve Bias Test |
JESD22-A108B
|
This test checks for resistance to moisture penetration by using an electrolytic principle to accelerate corrosive mechanisms. |
| PRCL-Power Cycling Test |
JESD-A105
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The test is normally applied to scrutinize die bond thermal fatigue. |
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